PCI-Express 3.0 - Chipset Z270 / Z370

As was to be expected, a series of microprocessors 'Skylake' was replaced by the series of microprocessors 'Kaby Lake', which are based on the same but an improved and more stable technology. Thus, according to Figure at the bottom of page abaut the Z170 chipset, could 'Skylake' technological process to add another sub-phase called 'Optimization'. In fact, it would be the third stage after the introduction of new process technologies. In addition to improving the technological process, have been introduced and additional features, as new products are faster, more efficient and more stable. Additional improvements were introduced in the 'Coffee Lake' series of microprocessors with the Intel Z370 chipset (more about this chipset - here). The modifications apply to new peripheral technologies and chipsets are not compatible with earlier 'Skylake' or 'Kaby Lake' processors due to the re-assignment of some pins in the processor socket, so older products can not be upgraded by adding a new microcode to the BIOS.

The basic concept of chipset and microprocessor are shown in the following example in version for desktop PC.

Example XIV

In this example shown in the block diagram of the chipset Z270. Shown in the example motherboard supports Core i5 and Core i7 microprocessors of seventh generation planned with the socket LGA 1151, and microprocessors of eighth generation planned with the socket LGA 1151v2.

• Processor
  Processors codenamed 'Kaby Lake' are based on improved 14 nm technology (14+). Base and Turbo frequency is higher than its predecessor. Dynamically increases the processor frequency when applications demand more performance. Higher speed operation when you need it, and energy efficient when not. Integrated processor Graphics is upgraded to version 'HD 630'. These changes are not much more effective, the notable difference between the two processors is that the 'Core i7-7700K' is 5-10% faster than the previous generation 'Core i7-6700K'. So, what has really changed? There is one major feature - New Media Engine. The 7th-generation of Intel Core chips included hardware decode support for VP9 and HEVC 10-bit, with enables hardware decode of 4K video with minimal processor load.
  
  Difference between old and new high-end 'desktop' processors are:
  
  

  Intel® Core microprocessors
  Product Name	Core i7 - 8700K	Core i7 - 7700K	Core i7 - 6700K
  CodeName	Coffee Lake	Kaby Lake	Skylake
  Chipset	series 3XX	series 1XX & 2XX
  Essentials
  Processor Number	i7-8700K	i7-7700K	i7-6700K
  Status	Launched	Launched	Launched
  Launch Date	Q4'17	Q1'17	Q3'15
  Lithography	14 nm	14 nm	14 nm
  Socket	1151*	1151	1151
  Recommended Customer Price	$359.00 ~ $370.00	$339.00 ~ $350.00	$339.00 ~ $350.00
  Performance
  # of Cores	6	4	4
  # of Threads	12	8	8
  Processor Base Frequency	3.70 GHz	4.20 GHz	4.00 GHz
  Max Turbo Frequency	4.70 GHz	4.50 GHz	4.20 GHz
  Cache	12 MB Smart Cache	8 MB Smart Cache	8 MB Smart Cache
  Bus Speed	8 GT/s DMI3	8 GT/s DMI3	8 GT/s DMI3
  # of QPI Links	0	0	0
  TDP	95 W	91 W	91 W
  Supplemental Information
  Embedded Options Available	No	No	No
  Conflict Free	Yes	Yes	Yes
  Memory Specifications
  Max Memory Size (dependent on memory type)	64GB	64GB	64GB
  Memory Types	DDR4 - 2666	DDR4 - 2133 / 2400, DDR3L - 1333 / 1600	DDR4 - 1866 / 2133, DDR3L - 1333 / 1600
  Max # of Memory Channels	2	2	2
  ECC Memory Supported	No	No	No
  Max Memory Bandwidth			34.1 GB/s
  Graphics Specifications
  Processor Graphics	UHD Graphics 630	HD Graphics 630	HD Graphics 530
  Graphics Base Frequency	350.00 MHz	350.00 MHz	350.00 MHz
  Graphics Max Dynamic Freq.	1.20 GHz	1.15 GHz	1.15 GHz
  Graphics Video Max Memory	64 GB	64 GB	64 GB
  4K Support	Yes, at 60 Hz	Yes, at 60 Hz	Yes, at 60 Hz
  Max Resolution (HDMI 1.4)	4096×2304 @ 24 Hz	4096×2304 @ 24 Hz	4096×2304 @ 24 Hz
  Max Resolution (DP)	4096×2304 @ 60 Hz	4096×2304 @ 60 Hz	4096×2304 @ 60 Hz
  Max Resolution (eDP - Integrated Flat Panel)	4096×2304 @ 60 Hz	4096×2304 @ 60 Hz	4096×2304 @ 60 Hz
  DirectX Support	12	12	12
  OpenGL Support	4.5	4.4	4.4
  Quick Sync Video	Yes	Yes	Yes
  InTru 3D Technology	Yes	Yes	Yes
  Clear Video HD Technology	Yes	Yes	Yes
  Clear Video Technology	Yes	Yes	Yes
  of Displays Supported	3	3	3
  Device ID	0x3E92	0x5912	0x1912
  Graphics Output			eDP / DP / HDMI /DVI
  Max Resolution (WiDi)			1080p
  Max Resolution (VGA)			N/A
  Wireless Display			Yes
  Expansion Options
  Scalability	1S Only	1S Only	1S Only
  PCI Express Revision	3.0	3.0	3.0
  PCI Express Configurations	Up to: - 1×16, - 2×8, - 1×8 + 2×4	Up to: - 1×16, - 2×8, - 1×8 + 2×4	Up to: - 1×16, - 2×8, - 1×8 + 2×4
  Max of PCI Express Lanes	16	16	16
  Package Specifications
  Sockets Supported	FCLGA1151	FCLGA1151	FCLGA1151
  Max CPU Configuration	1	1	1
  Thermal Solution Specification	PCG 2015C (130 W)	PCG 2015D (130 W)	PCG 2015D (130 W)
  Temperature of JUNCTION	100°C	100°C
  Package Size	37.5 mm × 37.5 mm	37.5 mm × 37.5 mm	37.5 mm × 37.5 mm
  Low Halogen Options Available	See MDDS	See MDDS	See MDDS
  Temperature of CASE			64°C
  Advanced Technologies
  Turbo Boost Technology	2.0	2.0	2.0
  vPro Technology	No	No	No
  Hyper-Threading Technology	Yes	Yes	Yes
  Virtualization Technology (VT-x)	Yes	Yes	Yes
  Virtualization Technology for Directed I/O (VT-d)	Yes	Yes	Yes
  TSX-NI	Yes	Yes	Yes
  64	Yes	Yes	Yes
  Instruction Set	64-bit	64-bit	64-bit
  Instruction Set Extensions	SSE 4.1 / 4.2, AVX 2.0	SSE 4.1 / 4.2, AVX 2.0	SSE 4.1 / 4.2, AVX 2.0
  Idle States	Yes	Yes	Yes
  Enhanced Speed Step Technology	Yes	Yes	Yes
  Thermal Monitoring Technologies	Yes	Yes	Yes
  Identity Protection Technology	Yes	Yes	Yes
  Stable Image Platform Program (SIPP)	Yes	No	No
  VT-x with Extended Page Tables (EPT)			Yes
  Small Business Advantage			Yes
  Data Protection Technology
  AES New Instructions	Yes	Yes	Yes
  Secure Key	Yes	Yes	Yes
  Software Guard Extensions (SGX)	Yes	Yes	Yes
  Memory Protection Extensions (MPX)	Yes	Yes	Yes
  Platform Protection Technology
  OS Guard	Yes	Yes	Yes
  Execute Disable Bit	Yes	Yes	Yes
  Device Protection Technology with Boot Guard	Yes	Yes	Yes
  Trusted Execution Technology	Yes		No
  * The socket LGA 1151v2 is physically the same but some connectors (pins) have different electricall functions. It is not electronically compatible with socket LGA 1151 of previous microprocessor generations.

  
  In the above table yellow highlights the differences between the '14++', '14+' and '14' features of the most powerful desktop microprocessor. It is seen that optimized generation has better performance. At the time of creating these tables some features were not available. According to the individual firms can be seen that the performance of portable PCs (laptops) up to 30% better. The price is almost same, suggesting that the production line of the previous generation coming to an end.
  
  
• Z270 - Platform Controller Hub (PCH)
  Chipset is a link to an external PC devices (I / O Controller Hub), a basic feature of the chipset and support for processors manufactured in enhanced 14 nm technology and LGA 1151 package. Lithography of chipset is in 22 nm technology. The following animated Figure 3.5.44a shows the block-schema of Z270 and Z370 chipset.

Figure**** 3.5.44 Block-diagram of z270-z370 / Box of Core i7-7(8)700K. ( + / - )

As usual, Intel has a new line of chipsets to go with its new processors. Pay attention to the Intel Z270 chipset. Supports overclocking. Number of chipset PCI Express lanes is increased to 24 thus motherboard builders can split the lanes up among two or three slots for users interested in multiple-GPU setups. The main difference is – Intel Optane support. Optane is an all-new storage device technology that Intel says can offer speeds that beat the fastest solid-state drive, and it’s due out later this year (1917.). But you won’t be able to use it unless you have an Optane compatible motherboard. While new chipsets flank the new hardware, the older Z170 chipsets can accept new 7th-generation intel Core hardware, including the Core i7-7700K. This is enabled through a BIOS update from your motherboard manufacturer. You can simply drop in the new processor so long as you’ve updated BIOS beforehand.

Figure* 3.5.45 GIBABYTE 'GA-Z270M-D3H' motherboard. ( + / - )

The above Figure shows the mini version - ATX motherboard with Figure 3.5.42b. Although there is ATX version of the motherboard with a new chipset, presents a new version with a smaller motherboard to highlight differences in the application of new technologies, shown in the following table.

So, smaller motherboard has less internal connections (slots), but the design is almost the same as at predecessor. The reason for the rapid transition to the new technology is possible because there is no difference in the physical design of embedded integrated circuits, but in their characteristics. Differences in characteristics are shown in the table in red, and purple crossed letters shown is what the new design does not have. Obviously, no significant differences, except that all points to the newer USB standard and the multiple ports of that type, and a higher clock speed RAM. The motherboard 'GA-Z370M-D3H' looks physically almost the same, but it is only for the 8-th generation of 'Core' series of microprocessors.

The connectors on the rear of the motherboard are physically similar. The connections shown in Figure 5.3.46 refer to the motherboard GIBABYTE 'GA-Z270M-D3H' motherboard.

Figure 3.5.46 Connectors at 'GA-Z270M-D3H' motherboard.

Should you buy it? Yes, if you’re building or buying a new PC and looking to replace the processor in a PC that’s four years old (or older), and because of the enhanced '14+' note that was expected to help it stabilize the clock speeds and ensure better performance via Z170. For users of chipset Z170, move on to the Z270 chipset will not bring anything significant.

SUMMARY:

The content of the BIOS code Z170 motherboard is upgraded so that they can accept the seventh generation of microprocessors. Almost everything is the same except for the support Optane technology which old chipset does not have. But to use the new memory technologies presented will need more time and to move on to even greater miniaturization of the manufacturing process.

Intel Optane technology changes the face of computing with an unparalleled combination of speed, endurance and density of components. This new premium class of non-volatile memory gives users fast access to large sets of data, unleashing amazing new experiences for those who demand high performance, while maintaining high capacities. A brand new memory type in several decades called 3D XPoint. Intel and Micron claims that 3D XPoint will offer 1000 times better performance and endurance of existing NAND memory. The physical structure of 3D XPoint consists of wires forming a layer lattice-like structure. When viewed from above, it looks like little crosses, hence the name 3D XPoint. Intel and Micron also said that the technology is ready and will begin delivery of sample wafers to key customers later year (2017.).

So, if you have a motherboard on which is the very old chipset, and you have to plan its replacement, replace with the motherboard which has Z270 chipset, but if you have a Z170 chipset it is not necessary to replace the motherboard, only upgrade firmware of BIOS. The same can't be applied to motherboards with Z370 chipset that supports even more powerful 8th generation of microprocessors and some newer technologies for other types of devices. That is why 8th generation of processors can not be installed in older motherboards with BIOS upgrade as was possible with the 7th generation of processors. Modifications were made to the functions of individual pins of microprocessors case in order to support processors with even more cores, and individual groups of transistors are larger about increased performance as a single chip makes it larger, as shown in the following figure.

The reason is to avoid difficulties when switching to the finer chip making technology. Therefore, the 8th generation processors can not be installed in older motherboards with the BIOS upgrade as was possible with the 7th generation of microprocessors with the LGA 1151v1 socket. The 9th generation of Intel microprocessors is upgraded the 8th generation version with the same technology process and the LGA 1151v2 socket, and the Z390 chipset adds further improvements. It is not easy to exceed the technology threshold of 14 nm, so it is used solutions from 'locker' in purpose of competitiveness on the market.